Satellite User Terminals
SYSTEM & MODULE / AiM
Integrated Antenna-in-Module platforms built to make satellite links more capable, compact and deployable
Electronically Steered User Terminal
A Ku-band phased-array terminal designed for low-Earth-orbit satellite communications, enabling real-time satellite tracking, stable high-speed links and maintenance-free operation.
Scalable Communication System
Ultraband's Ku-band up/down converter for translating signals between IF and the Ku-band RF signal path. The enclosed unit brings RF, transmit IF, receive IF, reference-clock and power connections together in a compact platform for laboratory, terminal and system-integration use.
Airborne Beam-Control Terminal
A compact Ku-band beam-control terminal for unmanned aircraft, maintaining satellite connectivity beyond visual line of sight across long-distance missions.
High-Performance Antenna Arrays
Precision antenna arrays for satellite communications, aerospace and defense, available in X-, Ku- and Ka-band configurations
TECHNOLOGY STACK
Compound semiconductor expertise. System-level thinking.
Ultraband combines III–V device insight, RFIC design and array integration to solve the full signal-chain challenge—from transistor behavior to over-the-air performance.
01
GaN-on-SiC
High power density, efficiency and thermal performance for RF and Power applications.
02
GaAs pHEMT
Low-noise and highly linear MMIC solutions optimized for demanding front ends.
03
Phased Array
Beamforming architecture, AiM, up/down conversion and intelligent array control.
04
Design Services
Application-driven customization, simulation, evaluation and production transition.
Pioneering Ku- and Ka-Band Millimeter-Wave Technologies
We specialize in monolithic microwave integrated circuits (MMICs) for satellite applications, offering GaAs- and GaN-based ICs covering frequencies up to 31 GHz. Our portfolio includes high-performance RF switches, low-noise amplifiers (LNAs), power amplifiers (PAs), antenna-in-module (AiM) solutions, beamforming IC arrays, up- and downconverters, and control modules.
These technologies are widely used in satellite communications, enabling next-generation 6G non-terrestrial networks (NTN) to deliver high-speed, low-latency, and highly reliable connectivity.


Innovative GaN on SiC Power Devices
We specialize in developing high-breakdown-voltage GaN on SiC power devices that deliver high efficiency, low power loss, and excellent thermal management. These devices are ideally suited for AC/DC and DC/DC converters, EV charging stations, onboard chargers, high-power fast-charging systems, and AI server power supplies — delivering exceptional performance in energy conversion and high-power applications.
From EPI Materials to IC Design to System Solutions
We possess core expertise in epitaxial structure design and device layout optimization, supported by rigorous quality control and rapid mass-production capabilities to meet the demands of fast-growing global markets. With high efficiency and high linearity at the heart of our brand, Ultraband Technologies continues to advance RF and power technologies, unlocking limitless possibilities for a better world.

ABOUT ULTRABAND TECHNOLOGIES
Taiwan-born. Built for a connected world.
Founded in 2020 and headquartered in Hsinchu, Taiwan, Ultraband Technologies is a fabless semiconductor design company. Our mission is to become a leading global provider of III–V compound semiconductor RF and power devices, circuits, and modules for the communications, information technology, energy, and AI industries.
Carrying the Vision Forward, Pioneering the Future
In the 1990s, when compound semiconductors were still considered a niche field, a group of pioneers in Taiwan boldly chose to follow a path few had taken.
Through unwavering commitment and long-term dedication, they overcame formidable challenges in materials, manufacturing processes, and market development. Their efforts ultimately gave rise to the globally renowned WIN Semiconductors and secured Taiwan a vital position in the global compound semiconductor industry.
Today, the founding team of Ultraband Technologies carries forward the same original vision and pioneering spirit. Once again standing at the forefront of an industry transformation, we are advancing third-generation semiconductor technologies and high-frequency integrated circuit design.
Today, the founding team of Ultraband Technologies carries forward the same original vision and pioneering spirit. Once again standing at the forefront of an industry transformation, we are advancing third-generation semiconductor technologies and high-frequency integrated circuit design.
2020
Founded
III–V
Core platform


